Reliability Testing the Die-Attach of CPV Cell Assemblies.
Author: Bosco, N.; Sweet, C.; Kurtz, S.
Pages/Volumes: 9 pp.
Publication Year: 2011
Notes: 34th IEEE Photovoltaic Specialists Conference (PVSC '09), 7-12 June 2009, Philadelphia, Pennsylvania
Document Type: Conference Paper
NTIS/GPO Number: 1007343
Subject Code Description: Solar Energy - Photovoltaics
Abstract: Results and progress are reported for a course of work to establish an efficient reliability test for the die-attach of CPV cell assemblies. Test vehicle design consists of a ~1 cm2 multijunction cell attached to a substrate via several processes. A thermal cycling sequence is developed in a test-to-failure protocol. Methods of detecting a failed or failing joint are prerequisite for this work; therefore both in-situ and non-destructive methods, including infrared imaging techniques, are being explored as a method to quickly detect non-ideal or failing bonds.
Accession Number: 46058
Library Notes: NPL-1102 REV
Report Numbers: CP-5200-46058
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